库存1件
已缴纳
主要用于硅片、铌酸锂、光学玻璃、蓝宝石、阀片、机械密封件以及超硬材料的平面单面加压研磨抛光.
A型机床具有主动靠轮回转机构
B型机床压盘具有迥转系统
Mainly used for the flat surface pressure grinding and polishing of silicon wafer, lithium niobate, optical glass, sapphire, valve plate, mechanical seal, and super hard material.
A type machine tool has an active wheel revolving mechanism.
B type machine with rotary plate system.
