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主要用于高精度光学玻璃、石英晶片、陶瓷、硅片、蓝宝石等平面元件的精密抛光。
机床PLC数字程序控制运行模式可独立控制各种运行程序，具有各传动系统无级调速、定时控制、计数控制、顺序控制、远程故障报警等功能。设备操作简单、充分地满足于高精度光学零件加工工艺要求。
Mainly used for precision polishing high-precision optics, electronics, ceramics, silicon, mechanical parts, such as flat elements.
The PLC digital program can control the operation procedure individually. And it has transmission system stepless speed regulation, timing control, counting control, sequence control, remote fault alarm functions. Operations of the equipment are simpler, it can fully content the requirements of high-precision optical processing technology.
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主要技术参数Main technical specification |
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SLP28B |
SLP30B |
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SLP28B |
SLP30B |
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磨盘尺寸(花岗岩) Millstone size (granite) |
Φ2800 mm |
Φ3000 mm |
水盆直径 Tank dia. |
Φ3140 mm |
Φ3340 mm |
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单点跳动Jumpiness of single point 盘面跳动Jumpiness of Millstone |
≤0.01mm ≤0.10mm |
≤0.01mm ≤0.10mm |
校正盘规格 Correcting plate size |
Φ1480×110(mm) |
Φ1570×110(mm) |
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磨盘转速 Millstone rotating speed |
0～3 RPM（伺服无极Servo stepless） |
0～3RPM（伺服无极Servo stepless） |
加工范围 Processing scope |
≤Φ900mm |
≤Φ1000mm |
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主动轮转速 Driving wheel rotate speed |
0～300RPM（伺服无极Servo stepless） |
0～300RPM（伺服无极Servo steplesss） |
PLC操作界面 PLC Operation Panel |
AH102L(10”) |
AH102L(10”) |
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机床总功率 Total power |
12Kw/380V |
14kw/380V |
卡钳移动距离 Caliper swing |
≤180mm |
≤280mm |
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机床重量 Weight |
约10000 Kg about 10000Kg |
约12000 Kg about 12000Kg |
外形尺寸 Size |
3750x3420x1400（mm） |
4000×3650×1400 （mm） |
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机床的任何特殊需求都可根据用户的要求设计、制造 All machines can be designed and manufactured as required. |
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