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主要用于高精度光学玻璃、石英晶片、陶瓷、硅片、蓝宝石等平面、球面元件的精密研磨、抛光。
主轴、摆轴，转速、压力、时间可根据加工零件的需要单独分开精密调整。
Mainly used for precision grinding and polishing of plane, spherical surface of high precision optical glass, quartz, crystal, electronic components etc.
The spindle, pendulum shaft, speed, pressure and time can be adjusted separately according to the needs of machining parts.
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主要技术参数Main technical specification |
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加工镜盘直径 Machining dia. |
Φ≤250mm |
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主轴间距 Main axis dia. |
520mm |
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水盆直径 Tank dia. |
Φ420mm |
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摆幅 Swing amplitude |
0～100（mm）约40° |
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主轴转数 Speed of main axis |
0，5～40 RPM |
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主轴轴数 Amount of main axis 主轴精度 Precision of main axis |
4轴，螺纹M27×3 ≤0.01mm Four axis,Thread M27*3 |
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摆架摆次 Swing times of swing shelf |
0，5～40次/分 0，5～40times/min |
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机床总功率 Total power |
4.8KW/380V |
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外形尺寸 Size |
2340×980×1700(mm) |
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机床重量 Weight |
约1300kg about 1300 kg |
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机床的任何特殊需求都可根据用户的要求设计、制造。 All machines can be designed and manufactured as required. |
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