主要用于硅片、铌酸锂、光学玻璃、蓝宝石、阀片、机械密封件以及超硬材料的平面单面加压研磨抛光.

A型机床具有主动靠轮回转机构

B型机床压盘具有迥转系统

Mainly used for the flat surface pressure grinding and polishing of silicon wafer, lithium niobate, optical glass, sapphire, valve plate, mechanical seal, and super hard material.

A type machine tool has an active wheel revolving mechanism.

B type machine with rotary plate system.